Intel Gaudi 3 AI Accelerator Technical Paper - HL-325L OCP Accelerator Module TDP (VERBATIM)
whitepaper
Fields
id
sources/vb-intel-gaudi3-oam-hl325l-900w-tdpPublisher
Intel
Kind
whitepaper
Accessed
2026-10-04
notes
VERBATIM: 'The Intel Gaudi 3 AI accelerator OCP Accelerator Module (OAM) Card is offered to system designers in standard OCP OAM 2.0 Mezzanine card form and supports up to 900W Total Device Power (TDP) with passive cooling and up to 900W TDP with liquid cooling.' Vendor-stated 900 W for the OAM form factor, corroborated by Table 8's '900 W'. Directly contradicts data/accelerators/intel-gaudi3.json tdp_w=null plus its notes claim that TDP is not published. Note the figure is form-factor-specific: the same record covers both OAM HL-325 and PCIe HL-338, which are NOT the same TDP (see vb-intel-gaudi3-pcie-hl338-600w-tdp), so a single tdp_w field cannot hold both without a basis note.
Notes
VERBATIM: 'The Intel Gaudi 3 AI accelerator OCP Accelerator Module (OAM) Card is offered to system designers in standard OCP OAM 2.0 Mezzanine card form and supports up to 900W Total Device Power (TDP) with passive cooling and up to 900W TDP with liquid cooling.' Vendor-stated 900 W for the OAM form factor, corroborated by Table 8's '900 W'. Directly contradicts data/accelerators/intel-gaudi3.json tdp_w=null plus its notes claim that TDP is not published. Note the figure is form-factor-specific: the same record covers both OAM HL-325 and PCIe HL-338, which are NOT the same TDP (see vb-intel-gaudi3-pcie-hl338-600w-tdp), so a single tdp_w field cannot hold both without a basis note.
Cross-references
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