Biren (壁仞) BILI 166 series product pages: 166C, 166M, 166L

PRIMARY VENDOR SOURCE - and note how thin it is. Three product pages (166C, 166M, 166L) give ONLY form factor, TDP and use cases. 166C: full-height full-length 290 mm dual-width PCIe inference card, 300 W peak, fits 4-8U PCIe GPU servers. 166M: 4U OAM V1.1 air-cooled train+infer module, 550 W peak. 166L: cold-plate liquid-cooled OAM, 600 W peak. NOT ONE compute, memory-capacity or bandwidth figure is published on any of them. Software stack is BIRENSUPA. Vendor also claims first-in-China GPU-to-OCS optical interconnect commercialised. This is the honest state of Biren's public disclosure as of access - cf. cn-biren-wikipedia for the older BR100 claims.