inference/research
verifiedhigh · 0.95updated 2026-10-03

MetaX C550 product page (OAM GPGPU)

spec-sheet

Fields

id
sources/cn-metax-c550
Publisher
MetaX (沐曦)
Kind
spec-sheet
Accessed
2026-10-03
notes
PRIMARY VENDOR SOURCE. MetaX C550 is a flagship OAM module GPGPU compliant with OAM 1.5/2.0 standards. Product features: 64 GB GPU memory with end-to-end ECC protection, MetaXLink interconnect enabling 8-card full-interconnect topology at up to 896 GB/s, virtualization with software-defined partitioning at 1% granularity, maximum board power 450 W. The C550 3D Mesh Supernode supports up to 8 servers and 64 cards with 3D Mesh topology. MXMACA software stack is compatible with mainstream GPU ecosystems. NO compute throughput figure (TFLOPS or TOPS) is published on the product page. MetaX IPO'd on the SSE on 17 Dec 2025 (ticker 688802).

Notes

PRIMARY VENDOR SOURCE. MetaX C550 is a flagship OAM module GPGPU compliant with OAM 1.5/2.0 standards. Product features: 64 GB GPU memory with end-to-end ECC protection, MetaXLink interconnect enabling 8-card full-interconnect topology at up to 896 GB/s, virtualization with software-defined partitioning at 1% granularity, maximum board power 450 W. The C550 3D Mesh Supernode supports up to 8 servers and 64 cards with 3D Mesh topology. MXMACA software stack is compatible with mainstream GPU ecosystems. NO compute throughput figure (TFLOPS or TOPS) is published on the product page. MetaX IPO'd on the SSE on 17 Dec 2025 (ticker 688802).

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