AMD Instinct MI325X product page (TBP and Passive OAM cooling)
spec-sheet
Fields
id
sources/pwr2-amd-mi325x-product-pagePublisher
AMD
Kind
spec-sheet
Published
2024-10-10
Accessed
2026-10-03
notes
Live AMD product page. Requirements: 'Typical Board Power (TBP) 1000W Peak' and 'External Power Connectors 54V UBB'. Board Specifications: 'Cooling: Passive OAM' - identical cooling envelope to MI350X, so both generations land in the same liquid-requiring procurement bucket. Page also carries AMD's own comparison footnote referencing 'NVidia Blackwell HGX B100 (192GB) 700W GPU accelerator' and 'HGX B200 (192GB)', i.e. AMD's collateral is quoting the 700W figure, not the 1000W figure, for B200.
Notes
Live AMD product page. Requirements: 'Typical Board Power (TBP) 1000W Peak' and 'External Power Connectors 54V UBB'. Board Specifications: 'Cooling: Passive OAM' - identical cooling envelope to MI350X, so both generations land in the same liquid-requiring procurement bucket. Page also carries AMD's own comparison footnote referencing 'NVidia Blackwell HGX B100 (192GB) 700W GPU accelerator' and 'HGX B200 (192GB)', i.e. AMD's collateral is quoting the 700W figure, not the 1000W figure, for B200.
Cross-references
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